Designing for optimal signal integrity (SI) and electromagnetic compatibility (EMC) is crucial for electronic systems, and many of the techniques used to achieve good SI and EMC are overlapping. It is essential to consider these factors early in the design process, starting from the concept phase, through schematic capture and finally designing a PCB. Delaying consideration of these factors can result in more complicated and costly designs, wasted board spins, and missed schedules. Poor PCB-level or system-level design can lead to problems that cannot be rectified even with elaborate and expensive filtering and shielding methods. Early involvement and consideration can help avoid many of these issues.
The following are the main steps involved in designing for EMC and SI:
- High-level architecture and system planning
- Defining applicable standards and requirements
- Schematic capture and definition of critical nets
- Selecting PCB stack-up, providing design guidelines and constraints for PCB layout
- Component placement – review
- Decoupling, bypassing, I/O, and critical routing – review
- Non-critical routing – review
- Power and ground planes – review
As experts in high-speed design, we can provide our customers with a comprehensive review of specifications and schematics, work with them to generate detailed inputs for transition from electrical design (schematics) to physical design (PCB layout, chassis/system considerations), and offer guidance and assistance in troubleshooting. We can also serve as a liaison for obtaining EMC testing, reports, and certificates.
By following these steps and involving experts in high-speed design early in the process, our customers can ensure optimal SI and EMC, reduce costs, and avoid wasted time and resources.